Zen 3 architecture series#

This could mean that we see Chinese chips targeting AMD Ryzen and EPYC CPUs based on the Zen 3 core architecture by next year. The performance comparison shows a 3A5000 4 core CPU with 2.5 GHz clock speed compared to a Core i7-10700 'Comet Lake' CPU with 8 cores and 2.9 GHz clock speed.īecause the chips are made locally, the prices that these chips carry will be very economical for use in China's educational and tech centers.

Zen 3 architecture series#

Loongson also posted the simulated performance of their next-gen 6000 seriesĬPUs which offer up to 30 per cent higher fixed & 60 per cent higher floating-point performance versus the existing 5000 series chips. The Loongson 3A5000 is competitive in the single-core performance workloads vs a range of ARM chips (7nm) and even an Intel Core i7-10700. Meanwhile, Loongson also unveiled that they plan to launch their next-generation 6000 series chips which will offer a brand new microarchitecture and offer IPC on par with AMD's Zen 3 CPUs. So essentially, a multi-chiplet solution. Loongson also plans to release a 32-core variant based on the same architecture known as the 3D5000 and it will feature two 3C5000 dies on the same package. Loongson Technology's new processor also operates with four HyperTransport 3.0 SMP controllers that 'allow multiple 3A5000s to operate in unison inside a single system. AMD revealed the following major features for the next-gen processor. The information is part of confidential AMD documents that. I have tried reading through both the PDFs (Zen 3 section) as well as to gather data but I am not confident if what I understand is correct and would like to request assistance in clearing up my misunderstandings.The 3A5000 uses the Chinese in-house 64-bit GS464V microarchitecture, featuring support for DDR4-3200 dual-channel memory, a primary encryption module, two 256-bit vector units per core, and four arithmetic logic units. AMD Zen 3 is the next-gen processor architecture for future Ryzen chips, which has now officially been revealed and detailed. Official information regarding AMDs next-generation Ryzen 4000 CPU family based on the Zen 3 core architecture has been unveiled. I would like some help in verifying the information I gathered and how/where I can find the data I need for part 2.

However, I am unable to confirm the latency in part 2, I am also unable to find the issue time for these instructions. I think my information in point 1 is correct. Simple integer instruction has throughput 4 Unsure if the data I gathered for floating point is single or double precision Issue/latency of FMUL : 元 or L6 (from uops, not sure where to get issue time) Issue/latency of FADD : 元 or L6 (from uops, not sure where to get issue time) (Can execute 6 integer instructions per clock cycle on average as long as they are all different types)Ħ Floating Point FUs (Including 2 multiply/addition & 2 further addition), 2 Address Generation units The processor I have in mind is a Ryzen 7 5700X, here is what I gathered:Ĥ Integer ALU FUs (multiply/divide only use 1 out of 4) & 2 branch units & 3 Address Generation units I am not 100% sure if the information I gathered is correctly. I have went through to read up on more of the instruction latencies. Which starts at page 241 for Zen 3 details.Īnd this link for the instruction infos. I was using this link for the architecture. I am trying to find information regarding the integer & floating point functional units for the processor zen 3 architecture by AMD.Īs well as the issue time (minimum time between two operations) & latency of integer & floating point (single & double precision) addition & multiplication.